The SIASUN TSS-3000 is an Equipment Front End Module (EFEM) — the controlled interface that sits between a wafer fab's material transport system and a process tool's internal transfer environment. SIASUN positions the TSS-3000 as a SEMI-compatible front-end wafer transfer device and interface system, built around a dual-arm transfer robot with an external axis. This configuration is used to overlap pick-and-place motions and extend the reachable positions within the module's working envelope, supporting high transfer efficiency while keeping a deliberately small footprint. In its front-end role, the module coordinates wafer loading, alignment, hand-off, and transfer, helping maintain contamination control and standardized equipment communication while reducing operator contact with critical substrates.

The TSS-3000 transfers wafers either manually or in coordination with automated factory transport at MR or OHT (Overhead Hoist Transport) carrying levels, allowing it to integrate into modern automated fab logistics rather than relying on manual carrier handling alone. Deployed at the tool front end, it bridges the factory interface where carriers arrive and depart, the front-end handling volume, and the process tool interface — providing standardized mechanical and software interfaces and repeatable wafer transfers for semiconductor wafer processing lines. Configuration-specific details such as supported wafer sizes, load port counts, accuracy, cycle time, and cleanroom class are confirmed per project as part of the quotation process.